Silicon Copper Master Alloy, 7440-50-8, 7440-21-3

SILICON COPPER MASTER ALLOY

1. PRODUCT IDENTIFICATION AND CHEMICAL IDENTITY

2. CHEMICAL STRUCTURE

2.1. Molecular Structure

Silicon Copper Master Alloy is an intermetallic compound of copper (Cu) and silicon (Si). The alloy consists of a copper-rich solid solution matrix with finely distributed silicon-rich intermetallic phases. The primary phases present are Cu solid solution and Cu-Si intermetallic compounds such as Cu₅Si, Cu₁₇Si₃, and Cu₃Si, depending on the composition.

Crystal Structure:

                    SiCu MASTER ALLOY
                               |
                 Cu-Si Intermetallic Phases
                               |
             +----------------+----------------+
             |                |                |
         Cu-rich Matrix    Cu₅Si/Cu₁₇Si₃    Cu₃Si Phase
         (FCC)             (Intermetallic)   (Intermetallic)

2.2. Phase Structure and Crystallographic Properties

2.3. Crystal Structure Details

2.4. Microstructure

The microstructure consists of a copper-rich matrix with finely distributed silicon-rich intermetallic phases. The size and distribution of these phases depend on the cooling rate and silicon content. The intermetallic phases are generally hard and brittle, contributing to the overall hardness of the master alloy. The uniform distribution ensures consistent alloying during dilution.

3. PRODUCT GRADES AND TYPICAL PROPERTIES

Note: The "I" notation indicates incipient melting or a specific transformation point at the indicated temperature. These melting ranges ensure appropriate dissolution behavior in copper melts.

4. CHEMICAL COMPOSITION

Maximum Impurity Levels (weight %):

Note: Detailed analysis certificate is provided with each shipment.

5. PHYSICAL PROPERTIES

6. METALLURGICAL PROPERTIES

Phase Structure:

• Copper-rich solid solution matrix with silicon-rich intermetallic phases

• Fine distribution of Cu-Si intermetallic compounds

• Narrow melting range for rapid dissolution

Dissolution Rate:

• Rapidly dissolves in liquid copper at typical melting temperatures

• High silicon yield (>95%)

• Minimum slag formation

Microstructure:

• Fine and homogeneous distribution of silicon-rich phases within copper matrix

• Consistent alloying during dilution

• Uniform silicon distribution in the final alloy

7. APPLICATION AREAS

8. ALLOYING MECHANISM

8.1. Effects of Silicon Addition

8.2. Reaction Mechanism

During master alloy addition to molten copper:

Cu (liquid) + Cu-Si (master alloy) → Cu-Si (homogeneous melt)

The master alloy dissolves rapidly, releasing silicon which distributes uniformly throughout the melt. The intermetallic phases break down and silicon dissolves in the copper matrix or forms fine, dispersed intermetallic particles depending on the cooling rate and final composition.

9. PACKAGING

10. STORAGE AND HANDLING

Storage:

• Store in a dry, well-ventilated area

• Avoid contact with moisture and water to prevent oxidation

• Ambient temperature storage is acceptable

• No special temperature control required

• No shelf life limitation under proper storage conditions

Handling:

• Use appropriate lifting equipment for pallet weight

• Ingots are not brittle; normal handling is acceptable

• Avoid dropping to prevent damage to ingots or packaging

11. HEALTH, SAFETY AND ENVIRONMENT

Hazard Classification:

• Not classified as hazardous under normal conditions of use

• Solid ingot form presents minimal hazard

• During melting, high temperatures and metal splash risks

Preventive Measures:

First Aid:

Environment:

• Do not discharge residues into water or soil

• Dispose of waste in accordance with local regulations

For complete safety information, refer to the Safety Data Sheet (SDS) provided with the product.

12. QUALITY CONTROL

13. REGULATORY COMPLIANCE

14. QUICK REFERENCE TABLE

15. CRITICAL NOTICES AND BEST PRACTICES

CRITICAL NOTICES:

1. Silicon Content: Two grades available: 11Si and 15Si. Choose appropriate grade for the desired silicon content in the final alloy.

2. Melting Temperature: Melting ranges are grade-specific. Ensure appropriate temperature control during melting.

3. Deoxidizing Effect: Silicon acts as a deoxidizer. Consider this when calculating oxygen levels in the melt.

4. Corrosion Resistance: Silicon addition improves corrosion resistance. Suitable for applications requiring enhanced corrosion performance.

5. Not Hazardous: Not classified as hazardous in solid form. However, melting operations require appropriate safety measures.

6. Environmental Protection: Dispose of waste in accordance with local regulations.

BEST PRACTICE RECOMMENDATIONS:

Storage:

• Store in a dry, well-ventilated area

• Avoid contact with moisture and water

• No special temperature control required

• No shelf life limitation under proper conditions

Handling:

• Use protective gloves, safety shoes, and safety goggles

• Use appropriate lifting equipment for pallets

Melting:

• Preheat copper charge to appropriate temperature

• Add master alloy to the melt

• Gently stir for homogeneity

• Expected silicon recovery >95%

Waste Management:

• Do not discharge into sewers or water bodies

• Dispose in accordance with local regulations

LEGAL DISCLAIMER

This Technical Data Sheet (TDS) is for informational purposes only and is prepared based on available technical data. The user is solely responsible for determining the suitability of the product for their specific application and for complying with all local, national, and international regulations. For complete safety, storage, handling, transport, waste, and regulatory compliance information, the official Safety Data Sheet (SDS/MSDS) provided by the manufacturer/supplier must be consulted. This document does not substitute professional advice.