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Epoxy Resin, Epoxide Resin, Thermoset Resin, DGEBA Resin, EP, 25068-38-6, 1675-54-3

Epoxy Resin, Epoxide Resin, Thermoset Resin, DGEBA Resin, EP, 25068-38-6, 1675-54-3

Epoxy Resin (Epoxide Resin – DGEBA)

CAS Number: Varies by grade (e.g., DGEBA: 25068-38-6; 1675-54-3)
Chemical Formula: (C₁₈H₂₂O₃)ₙ (DGEBA based)
Molecular Weight: Variable (DGEBA monomer: ~340 g/mol; typical epoxy resins: 350–10,000+ g/mol)
Synonyms: Epoxide Resin, DGEBA Resin, Bisphenol-A Epoxy Resin, Thermoset Resin, EP, Diglycidyl Ether of Bisphenol A, Polyepoxide

1. CHEMICAL IDENTITY

Parameter Information
Product Name Epoxy Resin
Chemical Class Thermosetting Polymer, Oligomer
Functional Group Epoxide (Oxirane) groups
CAS Numbers 25068-38-6 (DGEBA polymer); 1675-54-3 (DGEBA monomer); 24969-06-0 (Novolac epoxy)
Synonyms Epoxide Resin, DGEBA Resin, Bisphenol-A Epoxy Resin, Thermoset Resin, EP, Diglycidyl Ether of Bisphenol A, Polyepoxide
Common Trade Names Araldite, Epon, DER, Epikote, Epofix, Rütapox

2. PHYSICAL PROPERTIES (Typical – Liquid DGEBA Grade)

Parameter Value
Physical State (25°C) Viscous liquid to solid (depending on molecular weight)
Color Colorless to pale yellow
Appearance Clear, transparent to slightly hazy
Odor Mild, characteristic
Melting Point (solid grades) 64 – 76 °C
Boiling Point (before polymerization) ~150 – 200 °C (decomposes before boiling)
Density (25°C) 1.15 – 1.20 g/cm³
Viscosity (25°C) 1,000 – 15,000 mPa·s (varies by grade)
Refractive Index (n₂₀/D) ~1.55
Flash Point ~150 °C (>300 °F) (closed cup)
Dielectric Constant 3.6 – 4.2 (at 25°C, 1 kHz)
Volume Resistivity 10¹⁵ – 10¹⁶ Ω·cm
Dielectric Strength 15 – 20 kV/mm

3. THERMODYNAMIC PROPERTIES

Parameter Value
Glass Transition Temperature (Tg, cured) 50 – 200 °C (depends on hardener and cure cycle)
Heat Deflection Temperature (HDT) 40 – 150 °C
Thermal Conductivity (cured) 0.15 – 0.25 W/m·K
Coefficient of Thermal Expansion (CTE) 45 – 65 ppm/°C
Autoignition Temperature >300 °C

4. SOLUBILITY PROPERTIES (Uncured Resin)

Solvent Solubility
Acetone Soluble
Methyl Ethyl Ketone (MEK) Soluble
Ethyl Acetate Soluble
Toluene Soluble
Xylene Soluble
Alcohols (Methanol, Ethanol) Limited solubility
Water Insoluble

5. CHEMICAL STRUCTURE

Parameter DGEBA (Diglycidyl Ether of Bisphenol A)
Repeat Unit -O-C₆H₄-C(CH₃)₂-C₆H₄-O-CH₂-CH(OH)-CH₂-
Epoxide Equivalent Weight (EEW) 170 – 200 g/eq (liquid); 450 – 5,000+ g/eq (solid)
Hydroxyl Content Increases with molecular weight
Functionality (typical) 2 (difunctional)

Chemical Structure Note: The epoxide (oxirane) ring is the reactive site. Crosslinking occurs when the epoxide ring opens and reacts with hardeners (amines, anhydrides, phenols).

6. PRODUCTION PROCESS

Step Description
Raw Materials Epichlorohydrin + Bisphenol A
Reaction Epichlorohydrin reacts with Bisphenol A in the presence of sodium hydroxide (NaOH)
Product DGEBA (Diglycidyl Ether of Bisphenol A)
Molecular Weight Control Excess epichlorohydrin yields low MW resins; higher Bisphenol A ratio yields higher MW resins
Modification Reactive diluents, plasticizers, or other monomers may be added
Alternative Types Bisphenol F epoxy, Novolac epoxy, Aliphatic epoxy, Cycloaliphatic epoxy

Reaction Equation (simplified):
n Bisphenol A + (n+1) Epichlorohydrin + 2n NaOH → DGEBA + 2n NaCl + n H₂O

7. CURING (CROSSLINKING) REACTIONS

Curing Agent Type Reaction Cure Temperature Properties
Amines (Aliphatic, Cycloaliphatic, Aromatic) Epoxide + primary amine → secondary alcohol + secondary amine 25 – 150°C High toughness, good adhesion
Anhydrides (e.g., MHHPA, HHPA) Epoxide + anhydride → polyester linkage (with catalyst) 80 – 200°C High Tg, good electrical properties
Phenolic Hardeners Epoxide + phenol → ether linkage 150 – 250°C High chemical resistance
Thiols (Mercaptans) Epoxide + thiol → thioether 25 – 80°C Fast cure, low temperature
Photoinitiators (UV Cure) Cationic or radical polymerization UV light exposure Rapid cure, room temperature

8. CURE CYCLE AND PROCESSING

Parameter Typical Range
Pot Life (at 25°C) 10 minutes to several hours (depends on hardener)
Cure Temperature Room temperature to 150°C (heat cure improves properties)
Cure Time 24 hours (RT) to 2-4 hours (heat cure)
Post-Cure (optional) 80 – 120°C for 1-4 hours (improves Tg and chemical resistance)
Mixing Ratio (Resin:Hardener) 1:1 to 4:1 (by weight or volume, depends on system)

9. MECHANICAL PROPERTIES (Cured, Typical)

Parameter Value
Tensile Strength 40 – 90 MPa
Flexural Strength 80 – 140 MPa
Compressive Strength 80 – 120 MPa
Tensile Modulus 2.0 – 4.0 GPa
Elongation at Break 2 – 10% (brittle to flexible depending on formulation)
Impact Strength (Izod) 10 – 50 J/m
Shore Hardness (D) 70 – 90

10. APPLICATIONS – ADHESIVES

Substrate Application
Metals (Steel, Aluminum, Copper) Structural bonding; high strength adhesive
Glass Optical bonding; glazing
Wood Furniture; construction
Plastics (ABS, PVC, Polycarbonate) With proper surface treatment
Composites Repair and assembly
Ceramics Industrial bonding

Typical Properties (Cured Epoxy Adhesive):

  • Lap shear strength (aluminum): 10 – 30 MPa

  • Excellent gap-filling capability

  • Low shrinkage upon curing (0.1 – 0.5%)

11. APPLICATIONS – COATINGS

Application Description
Floor Coatings Industrial floors, garage floors, anti-slip coatings; application rate: 2 – 5 kg/m² per layer
Marine Coatings Ship decks, tanks, anti-corrosion coatings
Tank Linings Chemical storage tanks, pipelines
Anti-corrosion Coatings Steel structures, bridges, offshore platforms
Powder Coatings Electrical insulation, appliance finishes

12. APPLICATIONS – COMPOSITES

Reinforcement Application
Carbon Fiber Aerospace components, high-performance sporting goods
Fiberglass (Glass Fiber) Boat hulls, wind turbine blades, automotive parts
Aramid (Kevlar) Ballistic protection, lightweight structures
Natural Fibers Eco-friendly composites

Composite Properties:

  • Very high strength-to-weight ratio

  • Excellent fatigue resistance

  • Good chemical resistance

13. APPLICATIONS – ELECTRICAL AND ELECTRONICS

Application Function
PCB (Printed Circuit Boards) FR-4 laminates (glass-reinforced epoxy)
Potting and Encapsulation Protect electronic components from moisture, vibration, chemicals
Insulators High voltage insulation, bushings
Semiconductor Packaging Chip encapsulation
LED Encapsulation Transparent, UV-resistant formulations
Conductive Adhesives Filled with silver or other conductive fillers

14. APPLICATIONS – ART, CRAFT, AND CASTING

Application Description
Jewelry Making Clear, high-gloss casting
Tabletops and Countertops Deep pour epoxy; self-leveling
Decorative Objects Coasters, trays, art pieces
Embedments Encapsulating flowers, coins, photographs
Floors (Decorative) Metallic epoxy, flake systems

Typical Casting Depth: 1 mm to 5 cm (depends on formulation; deep pour grades available)

15. APPLICATIONS – CONSTRUCTION AND INFRASTRUCTURE

Application Description
Concrete Repair Crack injection; spall repair; structural bonding
Anchor Bolts Epoxy anchoring systems for heavy loads
Rebar Bonding Epoxy-coated rebar for corrosion protection
Bridge Deck Overlays Wearing surfaces for bridges
Tunnel Linings Waterproofing and structural repair

16. COMPARISON WITH OTHER RESINS

Property Epoxy Resin Polyester Resin Polyurethane Resin Phenolic Resin
Adhesion Excellent Good Very Good Moderate
Chemical Resistance Excellent Good Good Excellent
Heat Resistance (HDT) 40-150°C 50-100°C 60-120°C 150-250°C
Shrinkage Very Low (0.1-0.5%) High (5-10%) Low (1-2%) Low
Tensile Strength 40-90 MPa 30-70 MPa 20-60 MPa 40-70 MPa
UV Resistance Poor (must be topcoated) Moderate Good Good
Cost Moderate to High Low Moderate Moderate
Cure Temperature RT to 150°C RT to 80°C RT to 100°C 150-250°C

17. SAFETY AND TOXICOLOGICAL PROFILE (Uncured Resin)

Parameter Value
Acute oral toxicity (rat, LD₅₀) >5,000 mg/kg (low toxicity)
Acute dermal toxicity (rabbit, LD₅₀) >2,000 mg/kg
Skin irritation May cause irritation; sensitizer (contact dermatitis)
Eye irritation May cause serious eye irritation
Skin sensitization Dermal sensitizer (can cause allergic reactions after repeated exposure)
Carcinogenicity Not classified as carcinogenic by IARC (cured resin is inert)
Mutagenicity Negative in standard tests

GHS Classification (Uncured Resin – typical):

Hazard Class Description
H315 Causes skin irritation
H317 May cause an allergic skin reaction
H319 Causes serious eye irritation
H335 May cause respiratory irritation
H411 Toxic to aquatic life with long-lasting effects

Important Note: Cured epoxy resin is inert, non-toxic, and safe for handling. All hazards relate to the uncured (liquid) state.

18. PERSONAL PROTECTIVE EQUIPMENT (PPE) – Uncured Handling

Protection Type Requirement
Respiratory Protection Organic vapor respirator when spraying or heating; good ventilation recommended
Hand Protection Nitrile gloves (not latex; epoxy penetrates latex)
Eye Protection Chemical splash goggles + face shield (for pouring/mixing)
Skin Protection Long sleeves, impermeable apron, barrier cream
Engineering Controls Local exhaust ventilation in work areas
Hygiene Measures Wash hands thoroughly after handling. Do not eat, drink, or smoke in work area. Use barrier cream before handling.

19. STORAGE AND HANDLING

Parameter Requirement
Storage Temperature 15-30°C (cool, dry)
Container Material Original airtight container (metal or plastic)
Incompatible Materials Strong oxidizing agents, strong acids, strong bases, amines (premature curing)
Protection Keep away from UV light (sunlight), moisture, heat sources
Ventilation Store in well-ventilated area
Shelf Life (unopened) 12-36 months (depends on grade and storage conditions)
Special Precautions Do not freeze. Prevent contamination with hardeners or moisture.

Shelf Life Extension: Store at 5-10°C for extended shelf life; allow to warm to room temperature before opening to prevent moisture condensation.

20. SUMMARY AND CRITICAL INFORMATION

Description: Epoxy resin is a thermosetting polymer containing reactive epoxide (oxirane) groups. The most common type is DGEBA (Diglycidyl Ether of Bisphenol A), produced from epichlorohydrin and bisphenol A. It is available as a colorless to pale yellow viscous liquid or solid, which cures (crosslinks) when mixed with a hardener (amine, anhydride, phenol, etc.) to form a rigid, strong, chemically resistant, and adhesive thermoset material.

Key Advantages:

  • Excellent adhesion to metals, glass, ceramics, wood, and many plastics

  • Very low shrinkage upon curing (0.1-0.5%)

  • High mechanical strength (tensile 40-90 MPa, flexural 80-140 MPa)

  • Outstanding chemical and corrosion resistance

  • High electrical insulation properties

  • Good heat resistance (HDT 40-150°C depending on hardener)

  • Versatile processing (RT to 150°C cure; UV cure available)

  • No volatile organic compounds (VOCs) in 100% solids systems

Key Limitations/Considerations:

  • Uncured resin is a skin sensitizer (can cause allergic contact dermatitis with repeated exposure)

  • UV degradation – will yellow and chalk upon prolonged sun exposure (requires UV-stable topcoat for outdoor use)

  • Higher cost than polyester resins

  • Requires accurate mixing ratios (unlike polyesters)

  • Brittle in unmodified formulations (can be modified with flexibilizers)

  • Exothermic reaction – large masses can overheat during curing

Major Applications Summary:

Sector Applications
Adhesives Structural bonding (metal, glass, wood, composites)
Coatings Flooring, marine, anti-corrosion, powder coatings
Composites Carbon fiber, fiberglass, aramid (aerospace, marine, automotive)
Electronics PCB laminates (FR-4), potting, encapsulation, insulation
Art & Casting Jewelry, tabletops, decorative objects, embedments
Construction Concrete repair, anchor bolts, bridge overlays

Typical Formulation Ratios:

Application Resin : Hardener (by weight)
Adhesive systems 1:1 to 4:1
Floor coatings 2 – 5 kg/m² per layer
Casting (clear) 100% resin + 1-5% pigment/filler (plus hardener)

Safety Summary (Uncured Resin):

  • Moderate health hazard (skin/eye irritant; dermal sensitizer)

  • PPE required: Nitrile gloves, safety goggles, protective clothing, ventilation

  • First aid: Wash skin/eyes immediately with plenty of water for 15 minutes

  • Cured resin is inert and non-hazardous

Conclusion: Epoxy resin is a versatile, high-performance thermosetting polymer essential to modern manufacturing and construction. Its superior adhesion, low shrinkage, chemical resistance, and mechanical strength make it ideal for adhesives, coatings, composites, electronics, and many other demanding applications. While the uncured resin requires careful handling to prevent sensitization and irritation, the cured material is inert, durable, and safe for end-use applications.

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