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Epoxy Resin, Epoxide Resin, DGEBA Resin, Thermoset Resin, EP

Epoxy Resin, Epoxide Resin, DGEBA Resin, Thermoset Resin, EP

🌟 Epoxy Resin

A) Physical and Chemical Properties

  • Chemical Structure: Thermosetting polymer containing epoxide functional groups

  • Molecular Weight: Varies by formulation (e.g. DGEBA ~340 g/mol)

  • Appearance: Clear to pale yellow viscous liquid or solid granules

  • Melting Point: ~64–76 °C for solid types

  • Boiling Point (pre-cure): ~150–200 °C

  • Density: ~1.15–1.20 g/cm³ @ 25 °C

  • Solubility: Compatible with acetone, MEK, ethyl acetate; limited water solubility

  • Refractive Index: n₂₀/D ~1.55

  • Flash Point: ~150 °C

  • Dielectric Constant: ~3.6–4.2

  • Viscosity: 1000–15000 mPa·s depending on grade

  • Storage: Store in dry, cool conditions away from UV and moisture

B) Applications

  • Adhesives: High-strength bonding for metals, glass, wood, and plastics

  • Coatings: Floor coatings, marine tank linings, corrosion-resistant layers

  • Composites: Reinforcement systems with carbon or glass fibers

  • Electronics: PCB insulation, potting compounds, encapsulation

  • Arts & Casting: Transparent pours for jewelry, table tops, decorative objects

  • Construction: Crack repair, anchoring systems, epoxy injection grouts

C) Manufacturing Method

  • Main Route: Epichlorohydrin + Bisphenol-A → DGEBA (Diglycidyl Ether of Bisphenol A)

  • Catalyst: Sodium hydroxide (basic medium)

  • Variants: Bisphenol-F, Novolac-based resins, aliphatic epoxies

  • Modifications: Reactive diluents, pigments, fillers, UV stabilizers

  • Purity: ≥99% for base monomers; varies by formulation grade

D) Chemical Reactions

  • Polymerization: Cured with hardeners (amines, anhydrides, phenolics)

  • Thermal Cure: From 25 °C up to 150 °C depending on application

  • UV Cure: In specialized systems with photoinitiators

E) Alternatives

  • Polyurethane Resin: More flexible, rapid curing

  • Polyester Resin: Lower cost, less chemical resistance

  • Acrylic Resin: UV-curable, fast processing

  • Phenolic Resin: Excellent thermal and chemical resistance

F) Synonyms Epoxy Resin, Epoxide Resin, DGEBA Resin, Thermoset Resin

G) Common Trade Names “Epoxy adhesive” “Floor coating resin” “Clear casting resin”

H) Usage Ratios

  • Adhesive systems: 50–100% resin + 10–50% hardener

  • Coatings: ~2–5 kg/m² depending on layer thickness

  • Casting applications: 100% resin + 1–5% pigment or filler as needed

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