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Copper Powder, Atomized Copper Powder, Electrolytic Copper Powder, Copper Flake, Spherical Copper Powder, Copper Granule, Copper Metallic Powder, Copper Dust, Copper Particle, 7440-50-8

Copper Powder, Atomized Copper Powder, Electrolytic Copper Powder, Copper Flake, Spherical Copper Powder, Copper Granule, Copper Metallic Powder, Copper Dust, Copper Particle, 7440-50-8

Copper Powder is a finely ground form of copper metal, widely used in electronics, metallurgy, coatings, and chemical applications due to its high conductivity and durability.

Properties

  • Chemical Formula: Cu

  • CAS Number: 7440-50-8

  • Purity: 99.99%

  • Density: 8.94 g/cm³

  • Particle Size: Ranges from 15 to 250 microns

  • Electrical Conductivity: 59.69 m/ohmm²

  • Thermal Conductivity: 385 W/mK

Applications

  • Electronics & Electrical Components → Used in circuit boards, motor parts, and electrical contacts.

  • Metallurgy & Powder Metallurgy → Essential for sintering and alloy production.

  • 3D Printing & Additive Manufacturing → Applied in precision engineering projects.

  • Chemical Industry & Catalysts → Used in catalyst production and chemical processes.

  • Coatings & Surface Treatments → Provides protective and conductive coatings.

  • Marine Paints → Used in anti-corrosion coatings for ships.

Copper powder is valued for its excellent conductivity, corrosion resistance, and versatility across multiple industries.

Copper Powder is known by several alternative names, including:

  • Atomized Copper Powder

  • Electrolytic Copper Powder

  • Reduced Copper Powder

  • Copper Flake

  • Spherical Copper Powder

  • Copper Granules

  • Copper Metallic Powder

  • Bronze Powder

  • Copper Dust

  • Copper Particles

  • The CAS number for Copper Powder is 7440-50-8

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