Copper Phosphorus Ingot, Phosphorized Copper Ingot, Electrolytic Copper Ingot, Copper-Phosphorus Master Alloy, Cu-P Ingot, Phosphor Copper, 7440-50-8, 7723-14-0

COPPER PHOSPHORUS INGOT (Cu-P INGOT / PHOSPHORIZED COPPER INGOT)

PRODUCT IDENTIFICATION INFORMATION

CHEMICAL STRUCTURE

    Copper Phosphorus Ingot (Cu-P)
    
    α-Copper Matrix (FCC Crystal Structure)
    with Phosphorus Atoms
    
         Cu  Cu  Cu  Cu
           \  |  /  |
            Cu Cu Cu Cu
           /  |  \  |
         Cu  Cu  Cu  Cu
    
    Phosphorus (P) Atoms Dissolved in Copper Matrix
    Acts as Deoxidizer
    Critical Anode Material for Electroplating

Matrix: α-Copper solid solution (FCC crystal structure)
Phosphorus Distribution: Dissolved within copper matrix
Alloy Type: Copper-based, phosphorus-doped

SECTION 1: CHEMICAL IDENTITY AND DEFINITION

SECTION 2: CHEMICAL COMPOSITION AND TECHNICAL SPECIFICATIONS

SECTION 3: PHYSICAL PROPERTIES

SECTION 4: MASTER ALLOY GRADES

SECTION 5: CHEMICAL PROPERTIES AND REACTIVITY

SECTION 6: EFFECTS OF PHOSPHORUS ON COPPER

SECTION 7: INDUSTRY APPLICATIONS

7.1 Copper-Phosphorus Master Alloy (CuP8, CuP10, CuP15)

Application A: Deoxidation of Molten Copper and Copper Alloys

Application B: Production of Brazing Alloys

7.2 Phosphorized Copper Anode (Cu-DXP) - Electroplating

Application A: Printed Circuit Board (PCB) Production

Application B: Advanced Semiconductor Wafer Plating

SECTION 8: PHOSPHORIZED COPPER ANODE DISSOLUTION MECHANISM

Main Anode Reaction:

Cu → Cu²⁺ + 2e⁻

Role of Phosphorus:

• Forms a thin, conductive black film (copper phosphide) on the anode surface

• Suppresses formation of monovalent copper ions (Cu⁺)

• Reduces sludge formation to ≤1% level

Difference from Phosphorus-Free Copper:

• Phosphorus-free copper: Cu₂O particles → Incomplete dissolution → Sludge accumulation (5-10%)

• Phosphorized copper: Black film → Homogeneous dissolution → Minimum sludge (≤1%)

SECTION 9: OPERATING RECOMMENDATIONS FOR ELECTROPLATING BATHS

SECTION 10: QUALITY SPECIFICATIONS

Master Alloy (CuP10)

Phosphorized Anode (Cu-DXP)

SECTION 11: TOXICOLOGICAL PROFILE

SECTION 12: GHS CLASSIFICATION AND LABELING

GHS Classification (in compliance with CLP and UN GHS):

Note: Not classified as hazardous in solid state. However, metal fume and dust generated during melting, welding or grinding are harmful to health.

Signal Word: WARNING

Hazard Pictograms: GHS09 (Environment), GHS07 (optional)

Hazard Statements (H-Codes):

SECTION 13: PRECAUTIONARY STATEMENTS (P-CODES)

SECTION 14: FIRST AID MEASURES

SECTION 15: FIRE-FIGHTING MEASURES

SECTION 16: STORAGE AND SHELF LIFE

SECTION 17: PACKAGING OPTIONS

SECTION 18: TRANSPORT INFORMATION

SECTION 19: REGULATORY STATUS

SECTION 20: OTHER NAMES AND SYNONYMS

SECTION 21: SUMMARY TABLE

SECTION 22: CRITICAL WARNINGS AND BEST PRACTICES

CRITICAL WARNINGS:

1. Non-hazardous material in solid state but metal fume and dust generated during melting, welding or grinding are harmful to health.

2. Not flammable (ingot). Fine dusts may form explosive mixtures with air under certain conditions.

3. Phosphorus content is critical: 8-15% for master alloy; 0.04-0.06% for anode. Wrong selection adversely affects performance.

4. Anode sludge: Phosphorized anode produces ≤1% sludge (5-10% for phosphorus-free copper).

5. Black film: The black film formed on the anode surface is critical for homogeneous dissolution.

6. Incompatibilities: Keep away from strong acids, oxidizers and halogens.

7. Environmental Warning: Copper and phosphorus are toxic to aquatic life. Waste must NOT be discharged into sewers or directly to the environment.

8. Hygiene Requirement: Contaminated work clothing must not be taken outside the workplace.

BEST PRACTICE RECOMMENDATIONS:

9. Master Alloy Use (Deoxidation):
Add CuP8, CuP10 or CuP15 to molten copper; Phosphorus removes oxygen as P₂O₅ slag; Obtain tougher, denser metal free from micro-porosity; Prevents hydrogen embrittlement.

10. Brazing Alloy Production:
Produce BCuP-2, BCuP-5 brazing rods using Cu-P master alloys; Phosphorus acts as self-fluxing agent on copper; Silver addition (BCuP-5) increases ductility.

11. PCB Electroplating (Cu-DXP):
Use phosphorized anode (Cu-DXP); Achieve flawless plating with minimum sludge (≤1%); Uniform and bright copper plating; Reduces bath maintenance costs by up to 80%; High current density performance.

12. Semiconductor Plating:
Ultra-high purity (≥99.99% Cu) and stable black film formation; Flawless plating at nanometer features; Prevents particle adhesion.

13. Use (Melting/Processing):
Ensure adequate ventilation; Use local exhaust systems; Use approved dust/fume mask, chemical safety goggles and protective gloves.

14. Personal Protective Equipment:
Use protective gloves (nitrile, neoprene), chemical safety goggles, full face shield, protective clothing and NIOSH approved respiratory protection (for dust/fume).

15. Hygiene:
Do not eat, drink or smoke while using; Wash hands thoroughly after use; Do not take contaminated work clothes home.

LEGAL DISCLAIMER:

The information provided in this document is based on our current knowledge and experience and is provided in good faith; however, since all conditions of use are beyond our control, it does not constitute a binding specification or warranty. This Technical Data Sheet is for informational purposes only. Users are responsible for testing suitability for their own applications. For complete safety, storage, use, handling, disposal and regulatory compliance information, reference should be made to the official Safety Data Sheet (SDS/MSDS) provided by the manufacturer/supplier.